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OKAMOTO GDM300晶圓研磨

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OKAMOTOGDM300晶圓拋光/晶圓背拋概要：ModelGDM300grinderisafullyautomaticcontinuousdownfeedgrindingmachinewithdualpolishingstationsforincreasedthroughput

詳細(xì)介紹

OKAMOTO GDM300晶圓拋光/晶圓背拋概要：

Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment. After completion at grind and polish, wafer is automatically transferred by robot to the mounter unit for UV exposure, detape, and mount. Pre-cut DAF feature is optional while single DAF is included. Coin-stack feature may be integrated. The local polishing unit removes subsurface damage for increased wafer die strength and the ability to handle final thickness of 25 microns.



OKAMOTO GDM300晶圓拋光/晶圓背拋特點(diǎn)： 

The process from back grinding to wafer mounting continuously by fully automatic system, 

Which enable to grind till 25um thickness.

With 2 head polishing stage, throughput is almost double compared with 1 polish head system.

Built in edge trimming system is available as an option for thin wafer process.

Dual index system, which polishing stage and grinding stage is completely separated, 

satisfy the cleanness required for TSV and MEMS process.

Less than Ra1? ultra luminance, ultra mirror surface is possible.



OKAMOTO GDM300晶圓拋光/晶圓背拋規(guī)格參數(shù)：

Maximum wafer-

machining diameter of wafer

12"

Grinding Spindle: Bearing type 

                            Motor 

                            Rapid feed speed

                            Grind feed speed

Air bearing, maximum 3000 rpm

5.5 kw, 4P, high frequency motor 

240 mm/min

1 to 999 µm/min

Grinding wheel size

?300 mm

Index Table: Number of work spindles 

                    Work spindle Bearing type 

                    Speed of Work Spindles             

3

Air Bearing

1 to 300 rpm

Automatic Sizing Device:

      Wafer thickness measuring system 

      Wafer minimum setting size resolution

      Wafer size display range

2 point contact in-process gauge,Laser Detection (Opt.)

0.1 µm 

0to 1.6 mm; extended range software available

Table Cleaning Device (Grinder side)

DI Water + Ceramic block

Wafer Cleaning Unit (Grinder side)

DI Water + Brush

Edge Trimming Device (Optional): 

                Max Spindle Speed

                Accuracy

Recommended for < 50 um.

1800 rpm 

+/- 5 µm

Number of Cassettes

2 cassette stations

Polish Station: Work Spindle

                       Polish head

                       Oscillation speed

                       Head Load

                       Pad size

2High Precision Ball Bearing Work Spindles on Index Table 

3Kw AC servo motor for 10 – 320 rpm

100 – 9,000 mm/min.

0 – 0.5 Kg/cm2

240mm for 300mm, 160mm for 200mm

Polish table speed

Vacuum Chuck material

3 Kw AC servo motor for 550 rpm max 

Alumina ceramics + porous ceramics

Integrated Mounter System:

                      Robot 

                      Vacuum Chuck 

                      Handling pads 

                      UV Irradiating 

                      Single DAF/Pre-Cut DAF 

                      Coin-Stack


6-Axis Mitsubishi Robot 

Porous Carbon Fiber Vacuum Chucks 

Carbon Fiber Handling Pads 

Standard UV Irradiation system 

Single DAF included/Pre-Cut DAF Optional 

Coin-Stack Included



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